iMOTION IMM100 series reduces PCB size
Infineon Technologies has introduced smart IPM motor controllers which feature full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink.
Cutting board space, BoM, and battery load
STMicroelectronics’ STHVDAC-253C7 digital controller for tunable capacitors, such as ST’s STPTIC family, has been designed to shrink the size, bill of materials (BoM), and power consumption of antenna-tuning circuits for stabilising smartphone RF performance.
Concurrent launches 3U VPX system
Concurrent Technologies has launched the SY TR2/525, a 3U VPX development system complete with an 8 or 12-core computing board that has a direct PCI Express link to four slots for additional peripheral boards.
Electronics Design Show: show preview
This year's Electronics Design Show (EDS) welcomes a host of exciting and innovative products. Here you can read about some of the exhibitors that will be at the show and the kinds of things you can expect to see.
Harwin expands its Gecko series
Harwin has extended the scope of its Gecko Screw-Lok (Gecko-SL) 1.25mm pitch connector solutions – which are mainly targeted at avionics, space, military and autosport deployment.
Mouser stocking GHI FEZ maker boards
Mouser Electronics is the first distributor to stock FEZ T18 maker boards, the latest boards in the FEZ series from GHI Electronics.
Solving ground-shift issues in SMPS
Every time a power MOSFET is switched on or off in a switched-mode power supply (SMPS), parasitic inductances cause ground shifts. This can lead to uncontrolled switching of gate driver ICs. In extreme cases, this results in electrical overloading of power MOSFETs and malfunctioning of the SMPS.
TI’s LMZM2360x step-down power modules
The Texas Instruments (TI) LMZM23600 and LMZM23601 step-down DC-DC power modules, housed in a compact, 3.8 mm × 3 mm × 1.6 mm MicroSiP package, are designed to reduce board space by up to 58%.
PCIM 2018 - SiC now, it’s real
Microsemi will be showcasing live and static demonstrations at PCIM to include three-phase Vienna power factor correction (PFC) topology reference design, SiC MOSFET driver boards, power core modules (PCMs) and hybrid power drives (HPD510 and HPD 520), DRF1300 reference design and DRF1510 reference design.
Crash proof board-to-board connector
Amphenol RF has released its newly developed HD-EFI product line. This 50 ohm micro-miniature interface is intended for blind-mate situations and mating multiple RF lines between printed circuit boards and have been designed to maximize radial and axial float in board to board applications.